SMSD Seminar : Transparent Electronics with Stretchability/Flexibility
Thursday, December 05, 2019 at 4:00pm
Professor Seung Hwan Ko, Seoul National University, Korea
Wearable electronic devices are getting attention as future electronics which must function under various dynamic and large deformation. However, conventional electrical and material engineering approaches have limitations in terms of highly deformable electronics fabrication. Thus, a new approach by converging mechanical engineering viewpoint along with conventional electrical and material engineering is required. The objectives of our research are to propose and study an innovative concept of ‘mechanical percolation-based transparent metal network’ which maintains mechanical, electrical, and optical properties under extreme mechanical and dynamic deformation by regulating dimension of nano-material for the first time in the world, and to apply the findings to fabrication of unprecedented transparent & highly deformable soft electronic devices, where the “transparency” will add more functionality to the wearable electronics.
In this talk, I will present our recent study on the Transparent & Stretchable/Flexible Electronics and its application in soft robotics and wearable electronics. Furthermore, the total research cycle including material, process development and applications will be introduced.
Prof. Seung Hwan Ko is a professor in Applied Nano & Thermal Science Lab, Mechanical Engineering dept., Seoul National University, Korea. Before joining Seoul National University, he had been a faculty at KAIST (Korea Advanced Institute of Science and Technology), Korea since 2009. He received his Ph.D. degree in mechanical engineering from UC Berkeley in 2006. He worked as a researcher at Lawrence Berkeley National Lab until 2009. His research interest is flexible/stretchable electronics for wearable electronics and soft robot application, laser assisted nano/micro fabrication process development, laser-nanomaterial interaction, and crack assisted nanomanufacturing. Currently, he is an associate journal editor of Soft Robotics.